Thermal and Mechanical Design Guidelines 4
Figures
Figure 1. (G)MCH Non-Grid Array......................................................................11
Figure 2. Package Height .................................................................................12
Figure 3. Non-Critical to Function Solder Balls.....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale).........................................................
18
Figure 6. Airflow &Temperature Measurement Locations .......................................19
Figure 7. Cross-Cut Dimension Change of PWSHS Reference Design.......................22
Figure 8. ATX Boundary Conditions....................................................................24
Figure 9. Side View of ATX Boundary Conditions..................................................25
Figure 10. Processor Heatsink Orientation to Provide Airflow to (G)MCH
Heatsink on an ATX Platform..............................................................
25
Figure 11. Processor Heatsink Orientation to Provide Airflow to (G)MCH
Heatsink on a Balanced Technology Extended (BTX) Platform .................
27
Figure 12. Design Concept for ATX (G)MCH Heatsink — Installed on Board..............28
Figure 13. Design Concept for Balanced Technology Extended (BTX) (G)MCH
Heatsink Design — Installed on Board.................................................
28
Figure 14. (G)MCH Package Drawing .................................................................34
Figure 15. (G)MCH Component Keep-Out Restrictions for ATX Platforms .................35
Figure 16. (G)MCH Component Keep-Out Restrictions for Balanced Technology
Extended (BTX) Platforms.................................................................
36
Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 .......................37
Figure 18. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 .......................38
Figure 19. (G)MCH Reference Heatsink for ATX Platforms – Anchor ........................39
Figure 20. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1..40
Figure 21. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2..41
Figure 22. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip ..........42
Figure 23. (G)MCH Reference Heatsink for Balanced Technology Extended
(BTX) Platforms ...............................................................................
43
Figure 24. (G)MCH Chipsets Reference Heatsink for Balanced Technology
Extended (BTX) Platforms – Clip.........................................................
44
Tables
Table 1. Package Loading Specifications.............................................................12
Table 2. Thermal Specifications.........................................................................14
Table 3. (G)MCH Heatsink Boundary Condition Summary in ATX Platforms..............23
Table 4. (G)MCH Heatsink Boundary Condition Summary in BTX Platforms..............26
Table 5. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) .....................................................................................
29
Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level)............................
30
Table 7. ATX Intel Reference Heatsink Enabled Suppliers for (G)MCH .....................31
Table 8. BTX Intel Reference Heatsink Enabled Suppliers for (G)MCH .....................31
Table 9. Supplier Contact Information................................................................32
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