Reference Thermal Solution
21 Thermal and Mechanical Design Guidelines
4 Reference Thermal Solution
The design strategy for the reference thermal solution for the (G)MCH for use in ATX
platforms reuses the Intel
®
3 Series Chipsets reference thermal solution, Preload
Wave Solder Heatsink (PWSHS), see
Figure 18 and Figure 19. The ramp retainer, MB
anchors and the thermal interface material remains the same to meet the (G)MCH
thermal/mechanical requirements. The keep out zone remains the same as used with
the Intel 3 Series Chipsets, see
Figure 15.
The (G)MCH maximum TDP has been updated in Table 2. The TDP reduction may
allow system designers to lower thermal solution cost for McCreary and Boulder Creek
platforms. The reference design for the (G)MCH is a PWSHS which provides adequate
solder joint protection but may exceed thermal performance requirements in most
systems. Customers may save costs by reducing the heatsink size to meet the
lowered TDP.
The PWSHS reference design has the cross-cut dimension change from 3.75 mm to
3.90 mm (see
Figure 7) to prevent the gapping issue for cross-products heatsink
design (Intel
®
3 Series Chipsets and Intel
®
4 Series Chipsets).
Note: The nominal height of (G)MCH package (see
Figure 2) is 0.25 mm lower compared to
Intel
®
3 Series Chipsets package. Customers should analyze this gapping issue
resulting of thinner Intel
®
4 Series Chipsets package (nominal height of 2.13 mm)
compared to Intel
®
3 Series Chipsets package (nominal height of 2.38 mm) prior to
design.
Note: The PWSHS reference design retention requires zero gap (between anchor wire clip
and ramp retainer) to ensure effective top-side stiffening for solder joint protection.
This cross-cut dimension change design allows to be used on Intel
®
3 Series Chipsets
without assembly issue.
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