Intel 4 Series User Manual

Product Specifications
11 Thermal and Mechanical Design Guidelines
2 Product Specifications
2.1 Package Description
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1254 solder balls. The die size is currently 10.80 mm
[0.425 in] x 9.06 mm [0.357 in] and is subject to change. A mechanical drawing of
the package is shown in
Figure 14, Appendix B.
2.1.1 Non-Grid Array Package Ball Placement
The (G)MCH package utilizes a “balls anywhere” concept. Minimum ball pitch is
0.7 mm [0.028 in], but ball ordering does not follow a 0.7 mm grid. Board designers
should ensure correct ball placement when designing for the non-grid array pattern.
For exact ball locations relative to the package, refer to the Intel
®
4 Series Chipset
Family Datasheet.
Figure 1. (G)MCH Non-Grid Array
34 x 34mm Substrate [1.34 x 1.34 in]
Non-standard grid ball pattern. Minimum Pitch 0.7mm [0.028 in]

Intel 4 Series Specifications

General

Chipset Series	Intel 4 Series
Process Technology	65nm
Memory Type	DDR2, DDR3
SATA Ports	6
USB Ports	12
RAID Support	Yes (ICH10R)
Southbridge	ICH10, ICH10R
FSB	800/1066/1333 MHz
DirectX Support	DirectX 10 (on integrated graphics variants)
SATA Revision	2.0
Chipset Variants	G41, G43, G45, P43, P45
PCI Express Lanes	16
Max Memory	16 GB
Integrated Graphics	Intel GMA X4500 (G41, G43, G45)