Product Specifications
Thermal and Mechanical Design Guidelines 14
2.3.3 Thermal Specifications
The data in Table 2 is based on post-silicon power measurements for the (G)MCH. The
TDP values are based on system configuration with two (2) DIMMs per channel, DDR3
(or DDR2) and the FSB operating at the top speed allowed by the chipset with a
processor operating at that system bus speed. Intel recommends designing the
(G)MCH thermal solution to the highest system bus speed and memory frequency for
maximum flexibility and reuse. The (G)MCH packages have poor heat transfer
capability into the board and have minimal thermal capability without thermal
solutions. Intel requires that system designers plan for an attached heatsink when
using the (G)MCH.
Table 2. Thermal Specifications
Component Mem
Type
Sys
Bus
Speed
Mem
Freq
Max Idle
Power
(C1/C2
Enabled)
Max Idle
Power
(C3/C4
Enabled)
TDP T
C-MIN
T
C-MAX
Notes
Intel
®
G45
Chipset
DDR3 1333
MT/s
1333
MT/s
9 W 7.7 W 24 W 0 °C 103°C 1,2,3,4
Intel
®
G43
Chipset
DDR3 1333
MT/s
1067
MT/s
9 W 7.7 W 24 W 0 °C 103 °C 1,2,3,4
Intel
®
G41
Chipset
DDR3 1333
MT/s
1067
MT/s
11.5 W N/A 25 W 0 °C 102 °C 1,2,3
Intel
®
Q45 /
Q43 Chipset
DDR3 1333
MT/s
1067
MT/s
6W 4.7 W 17 W 0 °C 105 °C 1,2,3
Intel
®
Q45 /
Q43 Chipset
DDR2 1333
MT/s
800
MT/s
6W 4.7 W 17 W 0 °C 105 °C 1,2,3
Intel
®
Q43
Chipset
DDR3 1333
MT/s
1067
MT/s
5W 3.8 W 13 W 0 °C 105 °C 1,2,3,5
Intel
®
P45
Chipset
DDR3 1333
MT/s
1333
MT/s
9 W 7.5 W 22 W 0 °C 103 °C 1,2,3,6
Intel
®
P43
Chipset
DDR3 1333
MT/s
1067
MT/s
9 W 7.5 W 22 W 0 °C 103 °C 1,2,3,6
NOTES:
1. Thermal specifications assume an attached heatsink is present.
2. Max Idle power is the worst case idle power in the system booted to Windows* with no
background applications running.
3. Intel
®
P45, P43, G45, G43, Q45, and Q43 Chipset TDP is measured with DDR3 (or
DDR2) with 2 channels, 2 DIMMs per channel and Max Idle power is measured with
DDR3 (or DDR2) with 2 channels, 1 DIMM per channel. Intel
®
G41 Chipset TDP and Max
Idle power are measured with DDR3 with 2 channels, 1 DIMM per channel.
4. When an external graphic card is installed in a system with the Intel
®
G45, G43
Chipsets, the TDP for these parts will drop to approximately 22 W. The GMCH will
detect the presence of the graphics card and disable the on-board graphics resulting in
the lower TDP for these components.
5. The Idle and TDP numbers are assuming Internal Graphics is disabled on the Intel Q43
Chipset.
6. Idle data is measured on Intel P45, P43 Chipset when an external graphics card is
installed in a system wherein this card must support L0s /L1 ASPM.
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