Intel 4 Series User Manual

Reference Thermal Solution
Thermal and Mechanical Design Guidelines 22
Figure 7. Cross-Cut Dimension Change of PWSHS Reference Design
The BTX reference design for the (G)MCH will reuse the Z-clip heatsink and MB
anchors from the Intel
®
3 Series Chipsets thermal solution. The thermal interface
material and extrusion design requirements are being evaluated for changes
necessary to meet the (G)MCH thermal requirements. The keep out zone remains the
same as used with the Intel
®
3 Series Chipsets, see Figure 16.
This chapter provides detailed information on operating environment assumptions,
heatsink manufacturing, and mechanical reliability requirements for the (G)MCH.
4.1 Operating Environment
The operating environment of the (G)MCH will differ depending on system
configuration and motherboard layout. This section defines operating environment
boundary conditions that are typical for ATX and BTX form factors. The system
designer should perform analysis in the expected platform operating environment to
assess impact on thermal solution selection.

Intel 4 Series Specifications

General

Chipset Series	Intel 4 Series
Process Technology	65nm
Memory Type	DDR2, DDR3
SATA Ports	6
USB Ports	12
RAID Support	Yes (ICH10R)
Southbridge	ICH10, ICH10R
FSB	800/1066/1333 MHz
DirectX Support	DirectX 10 (on integrated graphics variants)
SATA Revision	2.0
Chipset Variants	G41, G43, G45, P43, P45
PCI Express Lanes	16
Max Memory	16 GB
Integrated Graphics	Intel GMA X4500 (G41, G43, G45)