Intel 945G - Product Specifications; Package Description; Non-Grid Array Package Ball Placement; Figure 1 Intel 945 G Express Chipset GMCH Non-Grid Array

Intel
®
945G Express Chipset GMCH Thermal Design Guide
Product Specifications
2 Product Specifications
2.1 Package Description
The Intel
®
945G Express Chipset GMCH is available in a 34 mm (1.34 in.) x 34 mm (1.34 in.)
Flip Chip Ball Grid Array (FCBGA) package with 1202 solder balls. The die size is currently 9.6
mm (0.378 in.) x 10.6 mm (0.417 in.). A mechanical drawing of the package is shown in Figure
10, Appendix B.
2.2 Non-Grid Array Package Ball Placement
The 945G Express Chipset GMCH package utilizes a “balls anywhere” non-standard grid ball
pattern. Minimum ball pitch is 0.8 mm (0.031 in.), but ball ordering does not follow a 0.8 mm
grid. Board designers should ensure correct ball placement when designing for the non-grid array
pattern. For exact ball locations relative to the package, contact your Intel field sales
representative.
Figure 1 Intel
®
945G Express Chipset GMCH Non-Grid Array
8 Order #308643