Intel 945G - Default Chapter; Table of Contents

Intel
®
945G Express Chipset GMCH Thermal Design Guide
Contents
Contents
1 Introduction..........................................................................................................................5
1.1 Scope........................................................................................................................ 5
1.2 Terminology.............................................................................................................. 5
1.3 Reference Documents.............................................................................................. 7
2 Product Specifications........................................................................................................ 8
2.1 Package Description................................................................................................. 8
2.2 Non-Grid Array Package Ball Placement ................................................................. 8
2.3 Package Loading Specifications............................................................................... 9
2.4 Thermal Specifications ............................................................................................. 9
2.5 Thermal Design Power (TDP) .................................................................................. 9
2.5.1 Methodology .............................................................................................. 10
2.5.2 Application Power...................................................................................... 10
2.5.3 Specifications............................................................................................. 10
3 Thermal Metrology............................................................................................................. 11
3.1 Case Temperature Measurements......................................................................... 11
3.1.1 Thermocouple Attach Methodology........................................................... 11
3.2 Airflow Characterization.......................................................................................... 12
4 Reference Thermal Solution............................................................................................. 14
4.1 Operating Environment........................................................................................... 14
4.1.1 1U Form Factor Operating Environment ................................................... 14
4.2 Mechanical Design Envelope ................................................................................. 16
4.3 Thermal Solution Assembly.................................................................................... 16
4.3.1 Solder-Down Anchors................................................................................ 16
4.3.2 Thermal Interface Material (TIM)............................................................... 17
4.4 Board-Level Component Keep-outs ....................................................................... 17
4.5 Environmental Reliability Requirements................................................................. 18
Appendix A Enabled Suppliers ............................................................................................................. 19
Appendix B Mechanical Drawings........................................................................................................20
Figures
1 Figure 1 Intel
®
945G Express Chipset GMCH Non-Grid Array................................................... 8
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4
5
6
Figure 2 0° Angle Attach Methodology (Top View)................................................................... 11
Figure 3 0° Angle Attach Heat Sink Modifications (Generic Heat Sink Side and Bottom View)12
Figure 4 Airflow Temperature Measurement Locations............................................................ 12
Figure 5 Thermal Solution Performance................................................................................... 15
Figure 6 Typical 1U Server Motherboard Component Placement............................................ 15
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