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Intel D33217GKE

Intel D33217GKE
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Intel® Next Unit of Computing
Board D33217GKE
Technical Product Specification
October 2012
Order Number: G67686-002
The Intel Next Unit of Computing Board D33217GKE may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board D33217GKE Specification Update.

Table of Contents

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Intel D33217GKE Specifications

General IconGeneral
Product CollectionIntel® Desktop Board
Intel® vPro™ TechnologyNo
Intel® High Definition Audio TechnologyYes
Intel® Rapid Start TechnologyYes
Intel® Anti-Theft TechnologyYes
Intel® Visual BIOSYes
Consumer Infrared Rx SensorNo
Number of USB Ports8
USB Revision2.0, 3.0
Integrated WirelessNo
Integrated BluetoothNo
S/PDIF Out ConnectorYes
HDMI Port1
eSATA PortNo
Number of Memory Channels2
Max Memory Bandwidth25.6 GB/s
Number of DIMMs2
ECC Memory SupportedNo
Memory Slots2
USB Ports8
Video OutputsHDMI
Supported Operating SystemsWindows 8, Windows 7
Internal Drive Form Factor2.5"
Integrated LANYes
Memory TypesDDR3
LAN10/100/1000 Mbps
Storage InterfacesSATA 6.0 Gb/s
Power Connector24-pin ATX

Summary

Preface

Intended Audience

Defines the target audience for this technical specification.

What This Document Contains

Lists the chapters and sections covered in the document.

Typographical Conventions

Explains symbols and abbreviations used throughout the specification.

1 Product Description

1.1 Overview

Provides a summary of the board's major features.

1.3 Processor

Describes the onboard Intel Core i3-3217U processor.

1.4 System Memory

Details the SO-DIMM sockets and supported memory configurations.

1.5 Intel QS77 Express Chipset

1.5.1 Direct Media Interface (DMI)

Explains the chip-to-chip connection between processor and PCH.

1.5.2 Display Interfaces

Details how display data is processed and sent to monitors.

1.6 Graphics Subsystem

Covers the integrated graphics features.

1.7 SATA Interface

1.7.1 AHCI Mode

Explains the support for AHCI storage mode.

1.9 LAN Subsystem

Details the Gigabit Ethernet controller and its features.

1.10 Hardware Management Subsystem

1.10.1 Hardware Monitoring

Details the hardware monitoring features based on an embedded controller.

1.10.2 Fan Monitoring

Explains how fan monitoring can be implemented.

1.11 Power Management

1.11.1 ACPI

Explains ACPI's role in system power management.

1.11.2 Wake-up Devices and Events

Lists devices/events that can wake the computer from sleep states.

2 Technical Reference

2.1 Memory Resources

Discusses addressable system memory and its allocation.

2.1.1 Addressable Memory

Details the 16 GB addressable memory and space allocation.

2.1.2 Memory Map

Lists system memory addresses and their descriptions.

2.2 Connectors and Headers

2.2.1 Back Panel Connectors

Shows and lists the back panel connectors.

2.2.2 Connectors and Headers (Bottom)

Illustrates internal connectors and headers on the bottom side.

2.3 BIOS Setup Configuration Jumper

2.4 Mechanical Considerations

Details the board's form factor and dimensions.

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

Covers external and internal power supply options.

2.5.2 Fan Header Current Capability

Lists the current capability of the fan headers.

2.6 Thermal Considerations

2.7 Reliability

Provides MTBF prediction for the board.

2.8 Environmental

Lists the environmental specifications for the board.

3 Overview of BIOS Features

3.1 Introduction

Introduces the Intel Visual BIOS and its storage.

3.3 System Management BIOS (SMBIOS)

Explains SMBIOS for managing computers in a network.

3.4 Legacy USB Support

Describes how legacy USB support enables older devices.

3.5 BIOS Updates

3.5.2 Custom Splash Screen

Explains how to augment the default splash screen.

3.6 BIOS Recovery

Details media types for BIOS recovery.

3.7 Boot Options

3.7.1 Network Boot

Allows booting from the onboard LAN or network card.

3.7.3 Changing the Default Boot Device During POST

Explains how to change boot device via POST menu.

3.8 Hard Disk Drive Password Security Feature

3.9 BIOS Security Features

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes

Describes blink patterns for front panel LEDs indicating errors.

4.2 BIOS Error Messages

Lists common BIOS error messages and their explanations.

4.3 Port 80 h POST Codes

Explains POST codes output to I/O port 80h for diagnostics.

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance

Details regulatory compliance information and standards.

5.1.1 Safety Standards

Lists safety standards the board complies with.

5.1.2 European Union Declaration of Conformity Statement

Provides the EU Declaration of Conformity.

5.1.3 Product Ecology Statements

5.1.3.1 Disposal Considerations

Addresses materials regulated upon disposal.

5.1.3.2 Recycling Considerations

Details Intel's product recycling program.

5.1.4 EMC Regulations

FCC Declaration of Conformity

Canadian Department of Communications Compliance Statement

States compliance with Canadian radio noise emission limits.

Japan VCCI Statement

Korea Class B Statement

Translation of Korea Class B statement for home use.

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance

5.1.6 Regulatory Compliance Marks (Board Level)

5.2 Battery Disposal Information

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