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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
• Soldered-down Intel
®
Core™ i3-3217U processor with up to 17 W TDP
― Integrated graphics
― Integrated memory controller
Memory
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz
SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Chipset
Intel
®
QS77 Express Chipset consisting of the Intel
®
QS77 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel
®
Graphics Technology:
― Two High Definition Multimedia Interface* (HDMI*) back panel connectors
Audio Intel
High Definition Audio via the HDMI v1.4a interfaces
Peripheral
Interfaces
― Three front panel ports (via one dual-port internal header and one front
panel connector)
― Two ports are implemented with vertical back panel connectors
― One port is reserved for the PCI Express* Half-Mini Card
― One port is reserved for the PCI Express Full-Mini Card
• SATA port:
― One internal mSATA port (PCI Express Full-Mini Card) for SSD support
Expansion
Capabilities
• One PCI Express Half-Mini Card connector
• One PCI Express Full-Mini Card connector
BIOS
• Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
continued
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