11
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
MicroATX (8.86 inches by 7.50 inches [225 millimeters by 190 millimeters])
Processor
•
3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 65 W TDP in an LGA1155 socket
― PCI Express* 3.0 x16 graphics interface
― Integrated graphics processing (processors with Intel
®
Graphics
Technology)
― External graphics interface controller
― Integrated memory controller with dual channel DDR3 memory support
Chipset
Intel
H61 Express Chipset consisting of the Intel
H61 Platform Controller
Hub (PCH)
Memory
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
Graphics
• Integrated graphics support for processors with Intel
Graphics Technology
― VGA
• Support for PCI Express 3.0 x16 add-in graphics cards
Note: PCI Express 3.0 is only supported by 3
rd
generation Intel Core
processor family processors
Audio
• Intel
®
High Definition Audio:
― Realtek* ALC662 audio codec
― Front panel audio header for Intel HD Audio and AC ’97 Audio support
continued
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