Product Description
31
1.8.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel H77 Express Chipset
• Realtek ALC898 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 5.
Item Description
A Rear surround
B Center channel and LFE (subwoofer)
C S/PDIF out (optical)
D Line in
E Line out/front speakers
F Mic in/side surround
Figure 5. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 47
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.3.1, page 50
The back panel audio connectors Section 2.2.1, page 46
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