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Form Factor | ATX |
---|---|
Socket | LGA 1155 |
Chipset | Intel H77 |
Memory Type | DDR3 |
Memory Slots | 4 |
Max Memory | 32 GB |
PCI Express x16 Slots | 1 |
SATA 6Gb/s Ports | 2 |
USB 3.0 Ports | 4 |
USB 2.0 Ports | 8 |
Network | Gigabit Ethernet |
Audio | 7.1 Channel HD Audio |
Memory Standard | DDR3 1600/1333 |
SATA 3Gb/s Ports | 3 |
Video Outputs | HDMI, DVI |
PCI Express x1 Slots | 3 x PCIe 2.0 x1 |
Details known design defects or errors that may cause the product to deviate from published specifications.
Defines the target audience for this technical product specification document.
Outlines the chapters and topics covered within the technical product specification.
Explains the conventions used for symbols and abbreviations throughout the specification.
Highlights important information, potential risks, and warnings for hardware operation.
Provides a summary of the board's major features and specifications.
Lists Intel web resources for finding information about the desktop board and its components.
Details supported processor families, wattage, and compatibility requirements.
Describes supported DDR3 SDRAM, DIMM configurations, and memory specifications.
Details the Intel H77 Express Chipset functions, including DMI and display interfaces.
Explains the function of the real-time clock and CMOS memory powered by a coin-cell battery.
Details the features of the legacy I/O controller, including serial, parallel, and CIR ports.
Describes the Intel HD Audio codec, supported formats, and jack configurations.
Details the Gigabit Ethernet controller, its features, and LAN connector status LEDs.
Covers hardware monitoring, fan control, and chassis intrusion detection features.
Explains ACPI, system states, wake-up devices, and hardware support for power management.
Explains the system's addressable memory capacity and memory map layout.
Details back panel and component-side connectors and headers with signal information.
Describes the 3-pin jumper block and its settings for BIOS setup modes (normal, configure, recovery).
Details the board's ATX form factor, dimensions, and mounting hole locations.
Discusses power supply requirements, current capabilities, and voltage rails.
Covers chassis ambient temperature, airflow, and component thermal limits.
Provides the Mean Time Between Failures (MTBF) prediction for the board.
Lists the environmental specifications including temperature, shock, and vibration limits.
Introduces the Intel BIOS stored in SPI Flash and its update capabilities.
Describes the size and organization of the BIOS flash memory device.
Explains the BIOS's automatic configuration of PCI Express devices.
Details SMBIOS information collected and reported by the BIOS for system management.
Enables USB devices for BIOS setup and OS installation before drivers load.
Explains methods and utilities for updating the system BIOS.
Details acceptable media types for BIOS recovery and recovery procedures.
Allows users to select boot devices like hard drive, optical drive, or network.
Provides techniques to optimize system boot speed and POST execution time.
Describes supervisor and user password settings for BIOS and boot security.
Lists options for performance enhancements like processor and memory multiplier adjustments.
Identifies the board-mounted speaker for audible error code information during POST.
Lists beep code patterns and their corresponding error types during POST.
Describes front-panel LED blink patterns that indicate specific errors during POST.
Lists common BIOS error messages and their explanations for troubleshooting.
Explains POST codes generated to I/O port 80h for identifying failure points.
Contains information on safety standards, EMC, EU declarations, and product certifications.
Provides safety precautions and guidelines for battery replacement and disposal.