11
775- Land LGA Package Insertion
1. Lift processor package from shipping media by grasping
the substrate edges ONLY.
Note: Orient processor package such that the Pin 1 triangle
mark is on bottom left and both key notches are on left side
2. Land Side Cover Handling: Remove land side cover with
the opposite hand by depressing larger retention tab and
peeling the cover away
3. Set and reserve the land side cover aside.
Note: Always keep the land side cover on the processor
when not in the socket.
4. Visually inspect the package gold pads: Scan the
processor package gold pad array for presence of foreign
material. Refer to Overview Module for FM cleaning
recommendations
5. Orient the package with IHS up. Locate Pin 1 and the two
orientation key notches
6. Carefully place the package into the socket body using a
purely vertical motion
CAUTION: Using Vacuum Pen for installation is not recommended
7. Verify that package is within the socket body and properly
mated to the orient keys
8. Close the socket by
i. Rotating the Load Plate onto the package HIS
ii. While pressing down lightly on Load Plate, engage the
Load Lever.
iii. Securing Load Lever with Load Plate tab under retention
tab of Load Lever
Press to remove
Pin 1 Indicator
Alignment Key
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