85894_M&R_TA7650C_A 2-3
2.2.1.5 BITE interface
The BITE interface consists of a A/D converter (IC 8) with 12 analog channels, reading
analog measurements from all modules. It communicates with the DSP on a SPI bus.
2.2.1.6 I/O interface
The I/O expander (IC12) provides the board with sufficient digital I/O lines for external and
internal interfaces. It communicates with the DSP on a SPI bus. All external interfaces are
passed through either relays or optocouplers for good immunity.
As part of the external interface, an RS232 (IC 34) and an RS485 (IC33) bus is provided
2.2.1.7 Ethernet controller
To simplify external communication, an on-board ethernet controller is implemented. This is
responsible for:
• MAC/PHY layer interaction with LAN (IC 44).
• Communication with DSP through memory bus.
2.2.1.8 Memory
The DSP needs external memory banks to work. The board is equipped with 32Mbit Flash (IC
1) and 128Mbit SDRAM (IC 3).
2.3 Front module
The front module consists of the front board and the front panel.
2.3.1 Front board
The front board contains the Graphical OLED display and the push buttons visible on the
front panel. The display is controlled trough the SPI bus. The push buttons and LED’s are
interfaced to an I/O expander (IC 1). The expander communicates with the DSP through the
SPI bus.
The Front board is connected directly to the TX main board trough connector PL1.
2.4 PA module
The PA module consists of the PA board with cooling profile and fans. It also contains the
Regulator board and rear wall with connectors.
2.4.1 PA board
RF amplifier:
The signal from the Modulator module, located on the TX main board, enters trough PL1. The
signal is buffered by transistor Q15 to achieve a good matching of the output of the
modulator.
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