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9.2 Storage & baking condition
1. Calculated shelf life in sealed bag: 6 months at <40℃ and <90% relative humidity(RH).
2. After bag is opened, devices that will be subjected to reflow soldering or other high
temperature process must be:
a. Mounted within: 24 hours of factory conditions ≤30℃ /60% RH, or
b. Stored at <10% RH under the protection against humidity and static electricity
3. Devices require bake before mounting, if:
a. Humidity indicator Card is >60% when read at 23±5℃
b. 2a or 2b not met
4. If baking is required, devices may be baked for 24 hours at 125±5℃
Note: if device containers cannot be subjected to high temperature or if shorter bake times
are desired, reference IPC/JEDEC J-STD-020 for bake procedure
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