Lenovo ThinkServer RD430 Guías Del Usuario

6.Sivasustituirundisipadordecalor,extraigaloscuatrotornillosquejaneldisipadordecaloralaplaca
delsistema.Serecomiendaqueextraigacuidadosamenteloscuatrotornillosdelaplacadelsistema
medianteelsiguientemétodoandeevitarcualquierdañoposiblealaplacadelsistema.
a.Extraigaparcialmenteeltornillo1,luegoextraigacompletamenteeltornillo3,luegovuelvaa
atornillar1yextráigacompletamente.
b.Extraigaparcialmenteeltornillo2,luegoextraigacompletamenteeltornillo4,luegovuelvaa
tornillar
2yextraigacompletamente.
Nota:Loscuatrotornillossonpiezasintegradasdeldisipadordecalor.Nointenteextraerloscuatro
tornillosdeldisipadordecalor.
Figura87.Extraccióndelostornillosqueaseguraneldisipadordecalor
7.Gireconcuidadoeldisipadordecalorparaliberarlodelmicroprocesadory,acontinuación,levanteel
disipadordecalorfueradelaplacadelsistema.
8.Apoyeeldisipadordecalorantiguoaunlado.Pongaencontactoelenvaseantiestáticoquecontiene
elnuevodisipadordecalorconcualquiersupercienopintadadelaparteexteriordelservidor.A
continuación,extraigaelnuevodisipadordecalordelpaquete.
Notas:
•Sivaasustituirundisipadordecalor,debeusarunaalmohadilladelimpiezaqueposiblementevenga
conelnuevodisipadordecalorparalimpiarlagrasatérmicadelapartesuperiordelmicroprocesador
antesdeinstalarelnuevodisipadordecalor.Deshágasedelaalmohadilladelimpiezacuandohaya
eliminadotodalagrasatérmicademicroprocesador.
•Cuandomanejeeldisipadordecalor,notoquelagrasatérmicadelfondodelconjunto.
Capítulo6.Instalación,extracciónosustitucióndehardware147

Lenovo ThinkServer RD430 Specifications

General

Bus type	QPI
Stepping	C2
FSB Parity	No
Scalability	2S
Processor code	SR0LN
Processor cache	15 MB
Processor cores	6
Processor model	E5-2420
System bus rate	7.2 GT/s
Processor series	Intel Xeon E5-2400
Processor socket	LGA 1356 (Socket B2)
Processor threads	12
Processor codename	Sandy Bridge EN
Motherboard chipset	Intel C600
Processor frequency	1.9 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	45 x 42.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.4 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	AVX
Thermal Design Power (TDP)	95 W
Number of processors installed	1
Maximum number of PCI Express lanes	24
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	32 GB/s
Maximum internal memory supported by processor	375 GB
HDD size	3.5 \
RAID levels	1, 10
HDD interface	Serial ATA, Serial Attached SCSI (SAS)
Optical drive type	DVD±RW
Supported HDD sizes	2.5, 3.5 \
Total storage capacity	0 GB
Maximum storage capacity	24 TB
Number of HDDs installed	0
Memory slots	12x DIMM
Internal memory	8 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systems	Windows Server 2008/2008 R2 (Standard / Enterprise / Datacenter)\\r Windows Small Business Server 2011(Standard / Premium Add On)\\r Novel SUSE Linux Enterprise Server (11.1 / 11.2)4\\r RedHat Enterprise Linux Server (5.7 / 6.1)\\r VMWare vSphere 5\\r Microsoft Hyper-v Server 2008\\r Microsoft Hyper-v Server 2008 R2 SP1
Trusted Platform Module (TPM) version	1.2
Chassis type	Rack (2U)
Power supply	800 W
Redundant power supply (RPS) support	-
Sustainability certificates	ENERGY STAR
PCI Express slots version	3.0
Processor ARK ID	64617
Intel® Turbo Boost Technology	1.0
Intel Identity Protection Technology version	0.00

Weight and Dimensions

Depth	720.6 mm
Width	442 mm
Height	87.6 mm
Weight	26500 g