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Lenovo ThinkServer RD450 Product Guide

Lenovo ThinkServer RD450
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Mirroring
Lockstep Mode
Configuration Guidelines
Memory can be configured to meet various needs and workloads subject to the following general rules:
Mixing memory type (RDIMM, LRDIMM) is not supported.
DIMM capacities and rank can be mixed.
When you are populating for the various RAS modes the following rules apply:
If memory mirroring or lockstep is used, DIMMs must be installed in pairs (minimum of one pair per
each CPU), and both DIMMs in a pair must be identical in type, size, and rank.
If memory sparing is used, one rank of a DIMM in each populated channel is reserved as spare
memory; therefore, Single Rank DIMMs cannot be used. DIMMs in a pair must be identical in type,
size, and rank.
Memory Optimization
The memory subsystem can be optimized for various factors, including performance, capacity, or power
consumption. Refer to the following guidelines when you are selecting memory options:
Guidelines for maximum memory performance:
Use all available memory channels (four per processor, eight total per system).
Use identical DIMM populations in size and speed across channels.
Populate both processors with equal amounts of memory.
Use the same number of ranks that are populated per channel.
Have at least two ranks available on each channel.
Guidelines for lowest memory energy consumption
Use fewer, higher capacity DIMMs. For example, a configuration of 8x 16 GB DIMMs often
has lower power requirements than a configuration of 16x 8 GB DIMMs, despite the same
capacity.
Populating more DIMMs per channel—but using fewer channels (the opposite of the
preceding bullet)—further reduces overall system energy use, but at the cost of significant
performance reduction.
Lenovo ThinkServer RD450 (E5-2600 v4) 11

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Lenovo ThinkServer RD450 Specifications

General IconGeneral
Tcase70.9 °C
Bus typeQPI
SteppingM1
FSB ParityNo
Scalability2S
Processor cache15 MB
Processor cores6
Processor modelE5-2609V3
System bus rate6.4 GT/s
Processor seriesIntel Xeon E5-2600 v3
Processor socketLGA 2011-v3
Processor codenameHaswell
Processor frequency1.9 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor package size52.5 x 45 mm
Processor front side bus- MHz
Processor operating modes64-bit
PCI Express configurationsx4, x8, x16
Supported instruction setsAVX 2.0
Thermal Design Power (TDP)85 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
Maximum number of SMP processors2
Maximum number of PCI Express lanes40
Memory types supported by processorDDR4-SDRAM
Memory channels supported by processorQuad
Memory clock speeds supported by processor1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)51 GB/s
Maximum internal memory supported by processor768 GB
Intelligent Platform Management Interface (IPMI) supportYes
HDD size- \
RAID levels0, 1, 10
HDD interface-
Optical drive typeDVD±RW
Supported HDD sizes2.5 \
Total storage capacity0 GB
Maximum storage capacity28.8 TB
Number of HDDs installed0
Number of HDDs supported8
Supported storage drive interfacesSAS, Serial ATA
Memory slots16
Internal memory8 GB
Memory clock speed2133 MHz
Maximum internal memory512 GB
Memory layout (slots x size)1 x 8 GB
Graphics cardAST2400
Security featuresPower-on & administrator password
Graphics card familyAspeed
Cabling technology10/100/1000Base-T(X)
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports3
PCI Express slots version3.0
Compatible operating systemsMicrosoft Windows Server 2012 R2, 2012, and 2008 R2, Windows Small\\r Business Server 2011, Windows Server Storage 2012 R2 and 2012, Windows\\r Multipoint Server 2012. Red Hat Enterprise Linux 7.0 and 6.5. SUSE Linux\\r Enterprise Server 11 SP3. VMware vSphere (ESXi) 5.1 P5 and 5.5 U2
BIOS typeUEFI
Chassis typeRack (2U)
Power supply550 W
Certification80 PLUS Platinum
Operating altitude0 - 3048 m
Storage temperature (T-T)-10 - 60 °C
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)8 - 90 %
Processor ARK ID81897
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version0.00
Weight and Dimensions IconWeight and Dimensions
Depth764 mm
Width482 mm
Height87 mm

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