52 SF01U
APPENDIX A - THROUGH-HOLE MOUNT OPTION
The Through-Hole Mount option for the SCF drive allows the drive to be mounted with the
heatsink outside of the enclosure for better heat dissipation. This is done by using a special
heatsink that mounts to the outside of the enclosure. The drive (which has a flat plate instead
of a heatsink) is mounted to the heatsink from the inside of the enclosure. This requires
cutting a hole in the enclosure that is slightly smaller than the heatsink. Up to NEMA 4X can
be achieved with this option. Panel cutout and mounting hole dimensions are provided below
for the different drive sizes.
NOTE
The temperature inside the enclosure must be maintained at 50 C or less,
and the ambient temperature outside of the enclosure must be 40 C or less.
Refer to Section 5.0 - SCF RATINGS for heat loss information.
THROUGH-HOLE DRAWING FOR MODELS UP TO 10 HP (7.5 kW)
Cutout view above is shown from the drive side (inside) of the panel.
HEATSINK
0.24 (6)
0.22 (5.6)
0.95 (24)
PANEL
CUTOUT
0.63 (16)
0.95 (24)
W
H
A B
E
A
MOUNTING
HOLES (#8)
0.63
(16)
E
F
F
J
K
KJ
B
C
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