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Ensures proper capacitor performance and longevity by detailing storage and operational parameters.
Defines critical electrical specifications and limits for capacitor operation.
Guidelines for proper soldering and mounting procedures for capacitors.
Covers additional important operational considerations and precautions under Caution.
Details how storage conditions affect capacitor performance and recommended practices.
Warns against corrosive gases and moisture condensation impacting solderability and performance.
Explains how temperature affects capacitance and recommends selection criteria.
Details capacitance variation within the rated temperature range and circuit considerations.
Guides on measuring capacitance accurately, considering voltage and frequency effects.
Explains capacitance variation with AC voltage and selection advice.
Specifies maximum voltage limits and consequences of overvoltage for capacitors.
Addresses self-heating due to applied voltage and current, and temperature limits.
Describes how capacitance changes with applied DC voltage and selection considerations.
Explains capacitance variation with AC voltage and selection advice.
Details the decrease in capacitance over time and its impact on circuits.
Warns against vibration, shock, and impact damaging capacitors or affecting reliability.
Advises on preventing damage during handling of PCBs with mounted capacitors.
Guidance on optimal capacitor placement and orientation to minimize stress.
Illustrates best practices for component alignment and stress reduction during board separation.
Key checks before mounting, including reuse, characteristics, and solderability.
Highlights the impact of Sn-Zn solder on MLCC reliability and the need for consultation.
Ensures correct nozzle pickup height to prevent board deflection and capacitor damage.
Emphasizes regular maintenance of suction nozzles and locating claws to prevent mounting defects.
Stresses the importance of preheating and controlling temperature differential for component integrity.
Advises maintaining temperature difference during solvent immersion to prevent damage.
Recommends aligning reflow temperature with solder specs to avoid quality issues.
Guides on optimal solder paste thickness for reflow soldering to prevent cracking or detachment.
Provides specific solder paste thickness guidelines for NFM series components.
Specifies which chip sizes are suitable for flow soldering and general conditions.
Emphasizes preheating and controlling temperature differential during flow soldering.
Warns against excessive soldering time or temperature causing termination leaching.
Recommends solder fillet height relative to chip thickness to prevent cracking.
Explains how thermal stress from correction can cause cracks and impact reliability.
Provides guidelines for using soldering irons and spot heaters for corrections, including techniques and parameters.
Discusses solder amount criticality for rework to avoid cracking or poor adhesion.
Specifies soldering iron tip size and contact method to prevent component damage.
Recommends solder wire diameter and type for rework.
Warns against excessive ultrasonic cleaning causing resonance, cracks, or joint failure.
Advises using support pins and avoiding vibration during PCB testing to prevent cracks.
Explains how bending or twisting stress during PCB cropping can crack capacitors.
Compares stress levels of different board separation methods and recommends router type.
Illustrates suitable jigs and apparatus for board separation to minimize stress.
Provides measures to reduce stress on components mounted near the board separation point.
Details disc separator alignment and V-groove parameters to prevent board deflection stress.
Highlights router type separators for stress-free board cutting and handling precautions.
Advises on proper board handling to prevent bending and damage to mounted capacitors.
Warns against board deflection stress when mounting components on the back side.
Recommends hole sizing, support pins, and board support to prevent cracks during lead insertion.
Guides on preventing board bending during socket attachment and screw tightening.
Details materials and procedures for die bonding capacitors using brazing alloys.
Outlines materials and techniques for wire bonding, including gold wire and bonding parameters.
Advises against direct contact and terminal short-circuits to prevent electrical hazards.
Lists unsuitable environments and the need for damp-proof measures.
Provides immediate actions for smoke, fire, or high temperature to prevent worsening hazards.
Specifies that capacitors must be disposed of via licensed industrial waste vendors.
Recommends fail-safe functions like fuses to prevent secondary accidents from cracked capacitors.
Emphasizes using safety-certified products for EMI prevention and AC circuits.
Details test equipment and voltage application methods for AC withstanding voltage tests.
Warns that failures can lead to short circuits and smoking, and data is typical.
Defines operating temperature limits and self-heating considerations for capacitor selection.
Discusses how atmosphere affects capacitor terminations and insulation resistance.
Explains vibration-induced noise in high dielectric constant capacitors and noise suppression.
Provides guidelines on land patterns to mitigate stress and prevent chip cracking.
Explains how PCB material and thermal expansion differences can cause capacitor cracking.
Recommends large ground patterns for NFM series to improve noise suppression effectiveness.
Provides land dimensions for flow soldering based on chip size and series.
Lists land dimensions for reflow soldering across various series and chip sizes.
Explains slit design for flux cleaning and resin coating, advising on length for mechanical stress.
Details land dimensions for NFM series in reflow soldering, including via hole specifications.
Provides land dimensions for NFM series in flow soldering, with part number and size information.
Analyzes how board thickness, length, and width affect strain and capacitor stress.
Lists key points for selecting adhesives, focusing on strength, corrosion, and health safety.
Emphasizes controlling curing temperature and time to ensure strength and prevent insulation issues.
Guides on using flux thinly and evenly, avoiding high halide or strong acid content.
Specifies limits for termination leaching during flow soldering to maintain chip integrity.
Warns that strong acidic flux in reflow solder paste can corrode capacitors.
Recommends evaluating cleaning equipment and solvents to confirm quality and select best options.
Warns that residual flux can degrade electrical characteristics and reliability.
Explains how coating resin contraction and thermal expansion differences can cause cracks or peeling.
Advises selecting less hygroscopic and non-corrosive resins to maintain insulation resistance.
Details required protection against temperature, humidity, and mechanical force during transport.
Warns against excessive vibration, shock, or pressure during transport causing damage.
Stresses the need to evaluate capacitors in the actual system for performance and specification confirmation.
Highlights voltage and temperature dependency of capacitance in high dielectric types.
Advises evaluating surge resistance and noise suppression effects in the actual system.
General