Nokia 2000 - List of Tables

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Table of Contents

Baseband System Module..................................................................................................................................... 5–5

Overview ........................................................................................................................................................... 5–5

Introduction: phone description .................................................................................................................... 5–5

Chipset and key components .......................................................................................................................... 5–6

BB block diagram ............................................................................................................................................. 5–7

Baseband functional description.................................................................................................................... 5–8

Baseband functional description............................................................................................................... 5–8

System power up ........................................................................................................................................ 5–9

Modes of operation.................................................................................................................................. 5–12

Power distribution................................................................................................................................... 5–12

Clocking concept....................................................................................................................................... 5–14

Audio concept........................................................................................................................................... 5–14

Baseband electrical interfaces: Battery ................................................................................................. 5–16

Baseband electrical interfaces: Charger................................................................................................. 5–16

Baseband electrical interfaces: Display(s) ............................................................................................. 5–17

Baseband electrical interfaces: Memory................................................................................................ 5–18

Baseband electrical interfaces: SIM........................................................................................................ 5–19

Baseband electrical interface: Dual SIM (for RM-761 only) .................................................................. 5–20

Baseband electrical interfaces: Audio components.............................................................................. 5–21

Baseband electrical interfaces: Backlight and illumination ................................................................ 5–21

Baseband electrical interfaces: Keyboard.............................................................................................. 5–22

Baseband electrical interfaces: Camera................................................................................................. 5–22

Baseband electrical interfaces: Memory card........................................................................................ 5–23

Baseband electrical interfaces: Vibrator................................................................................................ 5–23

Baseband electrical interfaces: BT module............................................................................................ 5–24

RF System Module............................................................................................................................................... 5–24

Overview ........................................................................................................................................................ 5–24

RF general description.................................................................................................................................. 5–24

Frequency plan .............................................................................................................................................. 5–24

Regulators and power supply concept........................................................................................................ 5–25

RF block diagram........................................................................................................................................... 5–26

BOM release version and RF part list ........................................................................................................... 5–28

List of Tables

Table 3 Chipset key components ......................................................................................................................... 5–6

Table 4 Quantum Frequency Plan..................................................................................................................... 5–25

Table 5 Power supply voltages for the X-GOLD213 IC RF sub-system ........................................................... 5–25

Table 6 Schematic differences between releases ........................................................................................... 5–28

List of Figures

Figure 48 Quantum block diagram...................................................................................................................... 5–7

Figure 49 Power up timing and system sleep................................................................................................. 5–10

Figure 50 System startup, SW view .................................................................................................................. 5–11

Figure 51 X-GOLD213 power management unit ............................................................................................. 5–12

Figure 52 Power supply distribution................................................................................................................ 5–13

Figure 53 XG213 clock generation and distribution....................................................................................... 5–14

Figure 54 X-Gold213 audio output selection................................................................................................... 5–15

Figure 55 Dual and single speaker configurations ......................................................................................... 5–15

RM-761; RM-799; RM-800

System Module

Issue 1 COMPANY CONFIDENTIAL Page 5 – 3