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Panasonic EB-X70 - Table of Contents

Panasonic EB-X70
82 pages
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Issue 1 – ii – PMCD030901C8
Revision 0 Service Manual
COMPANY LIABILITY
Every care has been taken to ensure that the contents of this manual give an accurate representation of the equipment.
However, Panasonic Mobile Communications Development of Europe Ltd. accepts no responsibility for inaccuracies which
may occur and reserves the right to make changes to the specification or design without prior notice.
The information contained in this manual and all rights in any design disclosed therein, are and remain the exclusive property
of Panasonic Mobile Communications Development of Europe Ltd.
Other patents applying to material contained in this publication:
CP8 PATENTS
Comments or correspondence concerning this manual should be addressed to:
Panasonic Mobile Communications Development of Europe Ltd.,
2 Gables Way
Thatcham,
Berkshire.
RG19 4ZB.
ENGLAND
CONTENTS
Page Page
1 INTRODUCTION 1
1.1 Purpose of this Manual 1
1.2 Structure of the Manual 2
1.3 Servicing Responsibilities 2
2 GENERAL DESCRIPTION 3
2.1 General 3
2.2 Features 3
2.3 Telephone Handset Main Kit 3
3 OPERATING INSTRUCTIONS 4
3.1 General 4
3.2 Controls and Indicators 4
3.3 Liquid Crystal Displays 5
3.4 Alpha Entry 5
3.5 Features Menu Structure 6
3.6 IMEI and Software Identification 7
3.7 SIM Personalisation 7
4 TECHNICAL DESCRIPTION 9
4.1 RF Overview 9
4.2 Transmitter 11
4.3 Receiver 12
4.4 Baseband Overview 13
4.5 CALYPSO+ 16
4.6 SYREN 18
4.7 Bluetooth Module 19
4.8 Power Supplies 20
5 REPAIR PROCEDURES 25
5.1 Introduction 25
5.2 Underfill Resin Paste 25
5.3 Lead Free (PbF) solder 25
5.4 Jigs and Tools 26
5.5 Using the Channel Box software 28
6 DISASSEMBLY / REASSEMBLY 29
6.1 General 29
6.2 Disassembly 30
6.3 Reassembly 35
7 INTERFACES AND TEST POINTS 39
7.1 Interfaces 39
7.2 Test Points 44
8 FAULT FINDING 46
8.1 RF Waveforms 46
8.2 BGA Fault Identification 48
8.3 Power on fault analysis 49
9 CALIBRATION PROCEDURES 51
9.1 Introduction 51
9.2 Carrier Power Calibration 51
9.3 RSSI 54
9.4 Battery Calibration 55
9.5 Camera Calibration 56
10 REPLACEMENT PARTS LIST 57
10.1 Sub-Assemblies 57
10.2 Main PCB Variants 59
10.3 Language Packs 59
10.4 Main PCB Components 59
10.5 Display PCB 63
10.6 Bulk Pack items 64
10.7 Jigs and Tools 64
10.8 Document Packs 64
11 CIRCUIT DIAGRAMS 65
12 LAYOUT DIAGRAMS 74
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