Quectel BG95-M3 - Recommended Footprint

LPWA Module Series
BG95 Hardware Design
BG95_Hardware_Design 71 / 80
7.2. Recommended Footprint
1.10
7.45 7.15
1.95
0.55
1.10
5.10
1.00
8.50
0.85
1.70
0.85
1.00
1.00
1.70
1.70
0.55
1.15
1.90
1.10
0.50
0.70
40x1.0
40x1.0
62x0.7
62x1.15
0.15
0.85
9.60 9.70
11.0311.03
4.254.25
5.955.95
7.657.65
2.55 2.55
9.18 9.18
4.25
5.95
4.25
5.95
0.85
0.20
0.20
0.20
0.20
19.90±0.15
1.00
1.00
23.60±0.15
Figure 33: Recommended Footprint (Top View)
1. For easy maintenance of the module, please keep about 3mm between the module and other
components on the host PCB.
2. All reserved pins must be kept open.
3. For stencil design requirements of the module, please refer to document [5].
NOTES
Pin 1