Quectel BG950A-GL - Recommended Footprint

LPWA Module Series
BG950A-GL&BG951A-GL_Hardware_Design
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8.2. Recommended Footprint
40x1.0
40x1.0
62x0.7
62x1.10
19.90±0.20
23.60±0.20
9.959.95
7.45 7.15
0.55
1.95
1.10
1.10
9.15 9.15
0.25
1.00
1.00
1.90
11.80 11.80
11.00 11.00
1.70
0.85
1.70
0.85
1.70
5.95 5.95
4.25 4.25
7.65 7.65
9.70 9.60
1.70
0.85
2.55
4.25
5.95
4.25
5.95
1.70
1.70
2.50
2.50
1.10
1.10
1.10
1.10
1.10
0.70
1.00
1.00
0.25
0.25
0.25
0.20
0.15
Figure 36: Recommended Footprint (Top View)
.
1. For easy maintenance of the module, keep about 3 mm between the module and other
components on the motherboard.
2. All reserved pins must be kept open.
3. For stencil design requirements of the module, see document [6].
NOTE
Pin1