Quectel EP06

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EP06 Module
Application Board
Thermal Pad
Shielding Cover
MiniPCIe Connector
Application Board
EP06 Module
PCBA
Thermal Pad
Figure 14: Referenced Thermal Pad Design
1. Make sure that customers’ PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. The module’s internal temperature must be kept below 105°C to protect the components from
damage when it is integrated to customers’ applications. And the temperature can be queried by
AT+QTEMP command.
NOTES