EasyManua.ls Logo

Quectel EG91 Series

Quectel EG91 Series
109 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
Loading...
EG91 Series
Hardware Design
LTE Standard Module Series
Version: 1.9
Date: 2020-09-03
Status: Preliminary
www.quectel.com

Table of Contents

Question and Answer IconNeed help?

Do you have a question about the Quectel EG91 Series and is the answer not in the manual?

Quectel EG91 Series Specifications

General IconGeneral
BrandQuectel
ModelEG91 Series
CategoryControl Unit
LanguageEnglish

Summary

Introduction

1.1. Safety Information

Essential safety precautions for operating the EG91 series module.

Product Concept

2.1. General Description

Overview of the EG91 series module and its variants.

2.2. Key Features

Details the main features and specifications of the EG91 series module.

2.3. Functional Diagram

Illustrates the major functional parts and architecture of the EG91 series module.

2.4. Evaluation Board

Describes the evaluation tools provided for testing and development.

Application Interfaces

3.1. General Description

Overview of the EG91 series module's interface pads and connection types.

3.2. Pin Assignment

Shows the physical pin layout and connections for the EG91 series module.

3.3. Pin Description

Provides detailed descriptions and characteristics of each pin.

3.4. Operating Modes

Outlines the different operating modes of the EG91 series module.

3.5. Power Saving

Describes power saving modes like Sleep Mode and Airplane Mode.

3.6. Power Supply

Details the power supply pins and rating requirements for the module.

3.7. Power-onoff Scenarios

Explains the procedures for turning the module on and off.

3.8. Reset the Module

Describes how to reset the EG91 series module using the RESET_N pin.

3.9. (U)SIM Interfaces

Details the (U)SIM card interfaces and their requirements.

3.10. USB Interface

Explains the USB interface specifications and its uses.

3.11. UART Interfaces

Describes the main and debug UART interfaces for communication.

3.12. PCM and I2 C Interfaces

Details the PCM and I2C interfaces for audio and control applications.

3.13. SPI Interface

Describes the SPI interface for peripheral device communication.

3.14. Network Status Indication

Explains the NETLIGHT pin for indicating network status.

3.15. STATUS

Details the STATUS pin for indicating module operation status.

3.16. ADC Interface

Describes the Analog-to-Digital Converter (ADC) interface.

3.17. Behaviors of RI

Explains the behavior of the Ring Indicator (RI) pin.

3.18. USBBOOT Interface

Details the USB_BOOT interface for firmware updates.

GNSS Receiver

4.1. General Description

Overview of the integrated Global Navigation Satellite System.

4.2. GNSS Performance

Shows the performance metrics for the GNSS receiver.

4.3. Layout Guidelines

Provides layout recommendations for GNSS antenna and traces.

Antenna Interfaces

5.1. MainRx-diversity Antenna Interfaces

Details the main and Rx-diversity antenna connections.

5.2. GNSS Antenna Interface

Describes the GNSS antenna interface and its specifications.

5.3. Antenna Installation

Covers antenna requirements and installation recommendations.

Electrical, Reliability and Radio Characteristics

6.1. Absolute Maximum Ratings

Lists the absolute maximum ratings for module pins and supplies.

6.2. Power Supply Ratings

Specifies the voltage and current ratings for the module's power supply.

6.3. Operation and Storage Temperatures

Details the operating and storage temperature ranges for the module.

6.4. Current Consumption

Provides detailed current consumption values for various operating states.

6.5. RF Output Power

Specifies the RF output power levels for different frequency bands.

6.6. RF Receiving Sensitivity

Lists the conducted RF receiving sensitivity values for various bands.

6.7. Electrostatic Discharge

Outlines ESD handling precautions and discharge characteristics.

6.8. Thermal Consideration

Provides guidelines for thermal management and heatsink design.

Mechanical Dimensions

7.1. Mechanical Dimensions of the Module

Shows the physical dimensions and tolerances of the module.

7.2. Recommended Footprint

Provides the recommended PCB footprint for module placement.

7.3. Top and Bottom Views of the Module

Displays top and bottom views for module identification.

Storage, Manufacturing and Packaging

8.1. Storage

Details recommended storage conditions and shelf life.

8.2. Manufacturing and Soldering

Provides guidelines for manufacturing and soldering the module.

8.3. Packaging

Describes the packaging methods used for the module.

Related product manuals