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Quectel EG91-EX User Manual

Quectel EG91-EX
109 pages
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EG91 Series
Hardware Design
LTE Standard Module Series
Version: 1.9
Date: 2020-09-03
Status: Preliminary
www.quectel.com

Table of Contents

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Quectel EG91-EX Specifications

General IconGeneral
CategoryControl Unit
Form FactorLGA
Operating Temperature-40°C to +85°C
LTE FDDB1/B3/B5/B7/B8/B20/B28
GSM850/900/1800/1900 MHz
Module TypeLTE Module
Power Supply3.3V
Storage Temperature-45°C ~ +90°C
InterfaceUSB 2.0, UART, I2C, SPI
Data Rate10Mbps (DL) / 5Mbps (UL)
Network ProtocolsTCP, UDP, HTTP, MQTT
GNSSGPS, GLONASS, BeiDou, QZSS
CertificationsCE, FCC, IC, GCF, PTCRB

Summary

1 Introduction

1.1. Safety Information

Safety precautions for using the EG91 series module during operation and service.

2 Product Concept

2.2. Key Features

Detailed description of the EG91 series module's key features and specifications.

2.3. Functional Diagram

Block diagram illustrating the major functional parts of the EG91 series module.

3 Application Interfaces

3.2. Pin Assignment

Visual representation of the EG91 series module's pin assignment.

3.3. Pin Description

Detailed pin definitions and descriptions for the EG91 series module.

3.5. Power Saving

Explains power saving procedures, including sleep and airplane modes.

4 GNSS Receiver

4.2. GNSS Performance

GNSS performance metrics including sensitivity and time-to-first-fix (TTFF).

5 Antenna Interfaces

5.1. Main/Rx-diversity Antenna Interfaces

Pin definitions and operating frequencies for main and Rx-diversity antennas.

6 Electrical, Reliability and Radio Characteristics

6.4. Current Consumption

Presents detailed current consumption values for various EG91 module variants.

6.5. RF Output Power

Specifies the RF output power capabilities of the EG91 series module.

6.6. RF Receiving Sensitivity

Provides conducted RF receiving sensitivity data for EG91 module variants.

7 Mechanical Dimensions

8 Storage, Manufacturing and Packaging

8.2. Manufacturing and Soldering

Guidelines for manufacturing, soldering, and recommended reflow thermal profiles.

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