LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design 10 / 106
Figure 42: Module Bottom Dimensions (Top View) .................................................................................. 91
Figure 43: Recommended Footprint (Top View) ...................................................................................... 93
Figure 44: Top View of the Module .......................................................................................................... 94
Figure 45: Bottom View of the Module .................................................................................................... 95
Figure 46: Recommended Reflow Soldering Thermal Profile .................................................................. 97
Figure 47: Tape Dimensions .................................................................................................................... 99
Figure 48: Reel Dimensions .................................................................................................................... 99
Figure 49: Tape and Reel Directions ..................................................................................................... 100
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