Quectel SC200R Series

Smart Module Series
SC200R&SC262R_Series_Hardware_Design 117 / 124
Temp. (°C)
Reflow Zone
Soak Zone
246
200
217
235
C
D
B
A
150
100
Max slope: 1~3 °C/s
Cooling down slope:
-1.5 ~ -3 °C/s
Max slope:
2~3 °C/s
Figure 44: Recommended Reflow Soldering Thermal Profile
Table 60: Recommended Thermal Profile Parameters
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
2–3 °C/s
Reflow time (D: over 217 °C)
40–70 s
Max temperature
235 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1