Need help?Do you have a question about the Quectel SG368Z Series and is the answer not in the manual?
General| Form Factor | LGA |
|---|---|
| 5G NR Frequency Bands | n1/n3/n5/n7/n8/n20/n28/n38/n41/n77/n78/n79 |
| LTE Frequency Bands | B1/B3/B5/B7/B8/B20/B28/B38/B40/B41 |
| LTE Bands | B1/B3/B5/B7/B8/B20/B28/B38/B40/B41 |
| WCDMA Frequency Bands | B1/B5/B8 |
| Interface | USB 2.0, UART, I2C, SPI, GPIO |
| Interfaces | USB 2.0, UART, I2C, SPI, GPIO |
| GNSS | GPS/GLONASS/Galileo/QZSS |
| Certifications | SRRC |
| Cellular Technology | 5G NR, LTE Cat 1, WCDMA |
| Storage Temperature | -40°C to +85°C |
Details on usage and reproduction rights for document content.
Information regarding the use of Quectel's trademarks and trade names.
Policy on data upload and processing for module functionality.
Liability limitations and disclaimers regarding document information usage.
Records changes made to the document over different versions.
Explains symbols and notations used throughout the document.
Highlights the main technical capabilities and specifications of the module.
Visual representation of the module's pin layout and numbering.
Detailed description of each pin's function, I/O type, and characteristics.
Details on power input requirements, voltage, and stability.
Procedures and timing for powering on the module using PWRKEY or PON_1.
Overview of the module's USB 3.0 and USB 2.0 capabilities.
Details on the SD card interface and its compliance with SD 3.0.
Information on UART interfaces, features, and pin descriptions.
Information on HDMI, MIPI DSI, eDP, and LVDS video output capabilities.
Information on the module's two PCIe interfaces.
Overview of wireless functionalities including Wi-Fi and Bluetooth.
Principles for designing PCB layouts for RF traces.
Defines the limit values for voltage parameters.
Specifies voltage and current ratings for the module's power supply.
Details power consumption in various operating modes for SG368Z-WF/AP.
Measures and guidelines for protecting the module from electrostatic discharge.
Provides the physical dimensions of the module in millimeters.
Recommended PCB footprint for module placement.
Requirements for storing the module in vacuum-sealed packaging.
Guidelines for the manufacturing and soldering process.
Requirements related to FCC certification for the module.
Approved antennas and conditions for host integration.
Industry Canada compliance statements and RF exposure information.
To Next Page