RF-43UP
www.szrfstar.com V1.3 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 6 of 34
Figure 7. Reference Design of the Connection between MCU and Module .................................... 13
Figure 8. Transparent Transmission Function Diagram ........................................................................... 18
Figure 9. Point Transmission Function Diagram ......................................................................................... 19
Figure 10. EN Timing Diagram of Wake-up Sleep MCU .......................................................................... 20
Figure 11. EN Timing Diagram during Sending Data ................................................................................ 20
Figure 12. EN Timing Diagram during Receiving Data ............................................................................. 21
Figure 13. EN Timing Diagram during Setting Data................................................................................... 21
Figure 14. Recommended Reflow for Lead Free Solder ......................................................................... 32
Figure 15. Optional Packaging Mode .............................................................................................................. 32
Table of Tables
Table 1. Parameters of RF-43UP ........................................................................................................................ 7
Table 2. Pin Functions of RF-43UP .................................................................................................................... 8
Table 3. Recommended Operating Conditions of RF-43UP ................................................................... 10
Table 4. Handling Ratings of RF-43UP ........................................................................................................... 10
Table 5. Current Consumption of RF-43UP .................................................................................................. 10
Table 6. Temperature Table of Soldering and Reflow ................................................................................ 31