Samsung ML-331xD - OPE Board; Bin-Full Sensor

3. Disassembly and Reassembly
3-13
Samsung Electronics
Service Manual
ML-331x/371x series
3.3.13 OPE board
3.3.14 Bin-full sensor
1. Remove the top cover. (Refer to 3.3.1 Cover)
2. Release the OPE board after removing 4 screws.
1. Remove the top / left cover. (Refer to 3.3.1 Cover)
2. Release the bin-full sensor after unplugging the connector.
CÓPIA NÃO CONTROLADA
CÓPIA NÃO CONTROLADA