EasyManua.ls Logo

Samsung VXK-306 - Page 6

Samsung VXK-306
70 pages
Print Icon
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
4.
Installing
the
Leadless
(chip)
Component
5,
Removing
of
Flate
ICs
1-4,
REPLACEMENT
PROCEDURE
FOR
LEADLESS
(CHIP)
COMPONENT
(Recommendable
manner)
Dae
ik.
ad
tact
points
of
the
circuit
board.
*
The
following
procedures
are
recommended
for
the
replacement
of
the
leadless
components
used
in
this
unit.
1)
Presolder
the
contact
poin
1)
For
removing
solder
chips
from
IC's
pins,
use
a
solder
remover
or
a
wiry
solder
absorber.
1.
Preparation
for
replacement
3.
Removing
the
chip
component
(Transistors,
Diodes)
2)
Heat
the
IC's
tips
evenly
by
moving
the
chip
IC
replacing
tool
around
them,
and
detach
the
IC's
leads
a.
Soldering
Iron
"Ty
Melt
the
solder
of
one
lead.
with
a
tool
in
the
way
of
using
a
lever.
Use
a
pencil-type
soldering
iron
that
uses
less
than
ZL.
Soldering
Iron
3)
Do
not
reuse
ICs
removed
once
(Discard
them).
30
watts.
b.
Solder
Presolder
Eutectic
solder
(Tin
63%,
Lead
37%)
is
recommended.
c.
Soldering
time
Tweezers
Do
not
apply
heat
more
than
4
seconds.
d.
Preheating
Leadless
capacitor
must
be
preheated
before
installation.
(130°
C~150°
C,
for
about
two
minutes).
2)
Press
the
part
downward
with
tweezers
and
solder
both
electrodes
as
shown
below.
y
Chip
IC
replacing
tool
Note
;
a,
Leadless
component
must
not
be
reused
after
removal.
; .
Note:
b.
Excessive
mechanical
stress
and
rubbing
of
the
2)
Lift
the
side
of
that
lead
upward.
Do
not
glue
the
replacement
leadless
component
to
the
circuit
board.
component
electrode
must
be
avoided.”
2.
Removing
the
leadless
component
(Resistors,
Capacitors)
oy,
Grasp
the
leadless
component
body
with
tweezers
and
Tweezers
alternately
apply
heat
to
both
electrodes.
When
the
Pan
solder
on
both
electrodes
is
melted,
remove
leadiess
<
:
Ge
Soldering
Iron
component
with
a
twisting
motion.
Solder
Note:
:
a.
Do
not
attempt
to
lift
the
component
off
the
board
until
the
component
is
completely
disconnected
from
the
board
by'a
twising
action.
b.
Take
care
not
to
break
the
copper
foil
on
printed
board.
3)
Simultaneously
heat
solder
of
the
two
remaining
leads
and
lift
part
to
remove.
Tweezers
Soldering
Iron:

Related product manuals