SIMATIC Industrial Flat Panels V2 1500/1900 4:3/5:4
18 A5E50653860-AA, 01/2021
Position of the mounting clips
Fasten the mounting clips to the positions as illustrated.
Connecting the device
Equipotential bonding
Differences in electrical potential
Differences in electrical potential can develop between spatially separate plant components. Such electrical potential
differences can lead to high equalizing currents across the data cables and therefore to the destruction of their interfaces.
Equalizing currents can develop if the cable shielding is terminated at both ends and grounded to different plant parts.
Differences in potential may develop when a system is connected to different mains supplies.
General requirements for equipotential bonding
Differences in potential must be reduced by means of equipotential bonding in order to ensure trouble-free operation of the
relevant components of the electronic system. The following must therefore be observed when installing the equipotential
bonding circuit:
• The effectiveness of equipotential bonding increases as the impedance of the equipotential bonding conductor decreases
or as its cross-section increases.
• If two plant components are interconnected by means of shielded data cables and their shielding is bonded at both ends
to the grounding/protective conductor, the impedance of the additionally installed equipotential bonding cable must not
exceed 10 % of the shielding impedance.
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