SECTION
3
3-1.
PRINTED WIRING BOARDS
1 2 3 4 5
6
7
8 9
10 11
12
13
14
15
16 17
1
18
19 20
21 22
[DISPLAY
BOARD]
[MAIN BOARD]
D
Note:
:
parts extracted
from
the component side.
•
SEMICONDUCTOR
LEAD LAYOUTS
CXD1125Q
M5293L
I
?
3a
i
mPD7521 2AG
F-TTX662AL
'
19
TOP
VIEW
DTA114ES
DTC114ES
DTC143ES
DTC144ES
2SA175-HFE
2SB1094L
2SB1068-K
2SC1815-Y
2SD774-34
B
HZS9B1L
RD4.3ES-B3
RD6.8ES-B1
1SS202-1
GP1U52XB
•
Semiconductor
Location
Ref. No. Location
Ref. No. Location Ref.
No. Location Ref. No. Location Ref. No. Location
D001
G-18 D402 D-7 IC001
D-18 IC451 E-5 0202
C-14
D002 G-18 D403 B-6
IC002
E-19 IC501 C-18 0304 B-17
D003 G-18 D404 B-6 1C101
F-16 IC502 C-19 0502 C-20
D004
G-18 D405 B-7 IC201 E-14 IC503 B-20
0503 C-20
D005 D-19 D406 B-7 IC202
F-14 0504 A-19
D006
E-19 D407 B-7 IC203 G-13 Q002 D-19 0602 C-20
D008
D-19 D408 B-7 IC301 B-16 Q003 E-18 0603 C-20
D009 E-12 D409 B-7 IC302 C-16 Q004 E-18 0604 B-19
D010 D-19 D501 D-20 IC304 B-17 Q005
A-17
D011
A-17 D502 C-20 IC305 C-17 Q101 G-16
0401
B-8 IC401 B-8 0201 D-14
6
-7-
-
8
-