8
HCD-HDX265/HDX266/HDX267W/HDX465/HDX466/HDX665
HARNESS SETTING
MAIN BOARD SERVICE POSITION
MAIN board
IO board
back panel
insulation sheet
1
Remove the back panel with
IO board
.
2
Remove the MAIN board.
3
Assemble the MAIN board to back panel block.
4
Reverse the back panel block.
Check not touch the heat sink.
lead pin
lead pin
flexible wire
Check not touch
the heat sink.
Check not touch the chassis.