Sony HCD-RG555 User Manual

1
Ver 1.0 2004. 04
CD
Model Name Using Similar Mechanism NEW
Section
CD Mechanism Type CDM74-F1BD81
Optical Pick-up Name KSM-215DCP/C2NP
Tape Deck Model Name Using Similar Machanism NEW
Section Tape Transport Mechanism Type CWM43RR-35
SERVICE MANUAL
E Model
HCD-RG555
Amplifier section
The following measured at AC 120, 127, 220, 240 V,
50/60 Hz
DIN power output (rated): 120 + 120 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
150 + 150 watts (6 ohms at
1 kHz, 10% THD)
Inputs
VIDEO/MD IN (phono jack):
voltage 450/250 mV,
impedance 47 kilohms
GAME INPUT AUDIO L/R (phono jacks):
voltage 250 mV,
impedance 47 kilohms
GAME INPUT VIDEO (phono jack):
1 Vp-p, 75 ohms
MIC (phone jack): sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
VIDEO OUT (phono jack):max. output level
1 Vp-p, unbalanced, Sync
negative, load impedance
75 ohms
SPEAKER: accepts impedance of 6 to
16 ohms
SPECIFICATIONS
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=770 – 810 nm)
Emission duration:
continuous
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
Tape deck section
Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-877-774-01
2004D04-1
© 2004. 04
– Continued on next page –
MINI HI-FI COMPONENT SYSTEM
• HCD-RG555 is the tuner, deck,
CD and amplifier section in
MHC-RG555.

Sony HCD-RG555 Specifications

General

Type	Mini Hi-Fi Component System
CD Player	Yes
Cassette Deck	Yes
Speakers	Yes
Speaker Type	2-Way Bass Reflex
Speaker Components	Woofer, Tweeter
Weight (Main unit)	5.5 kg
Tuner	FM/AM
Functions	CD Player, Tuner, Cassette Deck
Inputs	Aux In
Outputs	Headphone Out
Weight (Speakers)	3.5 kg

Summary

SAFETY CHECK-OUT

AC Leakage Test Procedure

Describes methods and limits for testing AC leakage current from metal parts to ground.

SERVICE HANDLING AND REPAIR NOTES

Optical Pick-up and Laser Safety

Covers safe handling of optical pick-up and laser diode emission checks.

Component Replacement and Soldering

Advises on chip component replacement and unleaded solder use.

Flexible Circuit Board Repair

Provides guidelines for repairing flexible circuit boards.

SERVICING NOTES

Service Positions

Describes specific setups for inspecting internal boards like AMP and BD81A.

DISASSEMBLY PROCEDURES

Case (Top) Disassembly

Procedure for removing the top case of the unit.

CD Door Disassembly

Procedure for removing the CD disc tray door.

Front Panel Section Disassembly

Procedure for removing the front panel assembly.

CD Mechanism Deck Disassembly

Procedure for removing the CD mechanism deck.

Tape Mechanism and Mic Jack Board Disassembly

Procedure for removing the tape mechanism and mic jack boards.

Panel Board Disassembly

Back Panel and Sub Trans Board Disassembly

Trans Board Disassembly

Main Board Disassembly

Amp Board Disassembly

BD81A Board Disassembly

Connect Board Disassembly

Driver Board, SW Board Disassembly

Optical Pick-up Disassembly

Sensor Board Disassembly

Motor (TB) Board Disassembly

Motor (LD) Board Disassembly

TEST MODES

AM Tuner Step Change

Cold Reset Procedure

Procedure to clear all data including preset data to initial conditions.

Aging Mode Operation

Panel Test Mode

MC Test Mode

CD Ship Mode (LOCK)

CD Ship (LOCK) & Cold Reset Mode

CD Service Mode

Disc Tray Lock Procedure

CD Repeat 5 Times Limit Release Mode

AMP Test Mode

DIAGRAMS AND CIRCUITRY

IC Pin Descriptions and Block Diagrams

Schematic Diagrams

Detailed circuit schematics for CD mechanism, main, panel, and power sections.