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Sony HT-CT770 - Page 30

Sony HT-CT770
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HT-CT770
HT-CT770
3030
For Schematic Diagrams.
Note:
All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
All resistors are in Ω and 1/4 W or less unless otherwise
speci ed.
f
: Internal component.
2 : Non ammable resistor.
5 : Fusible resistor.
C : Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
A : B+ Line.
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark
: POWER ON
*
: Impossible to measure
Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
Circled numbers refer to waveforms.
• Signal path.
F : AUDIO (ANALOG)
J : AUDIO (DIGITAL)
E : VIDEO
N : Bluetooth
• Abbreviation
AUS : Australian model
CH : Chinese model
CND : Canadian model
EA : Saudi Arabia model
SP : Singapore model
TW : Taiwan model
For Printed Wiring Boards.
Note:
X : Parts extracted from the component side.
Y : Parts extracted from the conductor side.
f
: Internal component.
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Circuit Boards Location
Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Abbreviation
AUS : Australian model
CH : Chinese model
CND : Canadian model
EA : Saudi Arabia model
SP : Singapore model
TW : Taiwan model
HDMI and MAIN boards are multi-layer printed board.
However, the patterns of intermediate layers have not
been included in diagrams.
Note: When the complete MAIN board is replaced, refer
to “NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD” on page 4.
Note: When the complete MAIN board is replaced, refer
to “NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD” on page 4.
MAIN board
HDMI board
POWER board
DISPLAY board
IO board
KEY board
bluetooth module
(BT1)
NFC module
(NFC1)
IR board
RF modulator
(RF1)
Ver. 1.1
Note: The components identi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number speci ed.
Note: Les composants identi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spéci é.

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