Sony HTC-D259 - Page 15

3-6. CASSETTE DECK SECTION PRINTED WIRING BOARDS
e See page 13 for Semiconductor Lead Layouts.
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789 9 8 7
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A
[AUDIO-B
BOARD
J
8
[AUDIO-A
BOARD
]
(CHASSIS)
MIOIB MIOIA
REEL MOTER REEL MOTOR
en
HRPIOI / HEIOI Mi02B HP101 MIO2A
RECORD/PLAY BACK / ERASE CAPSTAN MOTOR PLAY BACK GAPSTAN MOTOR
C HEAD
a
A A A
2 3 TO
Y Y Y TRANSFORMER
BOARD
F CN702
NX we NN
(CHASSIS )
G y 5
Q302
- S83 S86 $82
{LEAF SW B BOARD] METAL DET HALF DET CrO2 DET { LEAF sw-A $86 cer
HAL 102
sy
05
NORMAL
18
I9 20 2l
22
[TC PANEL (A) BOARD]
1-646 - 887~-
i
H
pcre
mim,
TO
MAIN
BOARD
CN653
23 24
[TC MAIN BOARD]
@e Semiconductor
Location -
Ret. No. Location
HTC-D259/D359
Note on Printed Wiring Board:
es o--—
parts extracted from the component side.