Sony SEQ-555ES - Page 20

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SEQ-555ES SECTION 5
DIAGRAM 5-1. MOUNTING DIAGRAM~ ©@ Refer to page 38 for semiconductor lead layouts.
1 2 3 4 5 6 7 8 9
Q
; iC | ic2
Ic
. oe a ee ts
1
;
1
'
’
39
38
4l 42 43 32.44
Note:
B e Color code of sleeving over the end of the jacket.
Cc
@ oO—-: parts extracted from the component side.
e 68 part mounted on the conductor side.
e B + pattern
@ =x==—p— :: signal path
D eo ame = L-CH signal path
© esecemeep> = R-CH signal path
E
F
G
H
I 38
37
J
A a a a a a
ee SN SUBS COAG A BEN OR Pe
LED CHIP UNIT
{EQ UP/DOWN BOARD)
Down] Sut —s Fe
S46
TAPE 2
45
10
SEQ-555ES
SEQ-555ES
11 12 13 14 15 16
IC 460 ;
1C459 1C458
706 755
704 705
ae 703
707
TO MIC JACK BOARD
{(A)MICRO COMPUTER BOARD
(W]
——————~30, 31, 37, 38>
22, 23,24, 32—34)>-_______—____—_—_—
(CHASSIS)
[POWER SW BOARD)
$7
v7
((C)MICRO COMPUTER BOARD
37 14
| SVp-p
olapsece—s} SS
a oe
—{20, 21,30 , 31)—