Sony SEQ-555ES - Page 29

mark
5-3.
MOUNTING DIAGRAM
1 2
113, 10104, 118, 20
303,304
12, 10102 C101 17
{ .
HHI 116 103 ,104
108 , Clos, icioe
115,114, 102 ,101
(C107, 108
301,302
(C121, ICLI9, ICT
ICHI5 , 1CHI3
Ic 122, 10120, Ice
ICt16, 1Cl14
1c 108—112
@ Refer to page 38 for semiconductor lead layouts.
——
4
5
2
(PIN JACK BOARD
isc
SEQ-555ES
SEQ-555ES
11 12 13 14
Note:
e Color code of sleeving over the end of the jacket.
O—:
parts
extracted
from
the
component
side.
@
ss:
part
mounted
on
the
conductor
side.
B
+
pattern
isd 7
—_—<—_P>=—
signal
path
eeeeee>
=~
L-CH
signal
path
eo
cm
>
©
R-CH
signal
path
1
(CHASSIS)
7 7,10,
TO SYSTEM CONTROL BOARD
8
(p) TO POWER TRANSFORMER(T8O!)
J301
AUTO EQ
a
MIC JACK
BOARD } U
|
eee TO (AY MICRO
COMPUTER BOARD
—O)(cHassis) (CHASSIS)
BLK
15