TABLE
OF
CONTENTS
Section
Title
Page
SECTION
1.
SERVICINGNOTE
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3
SECTION
2.
GENERAL
Parts
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5
SECTION
3.
DISASSEMBLY
3-1.
Removal
of
Case
ASSY
.....cccccceccessssesscesccscssececsecsecessesseseartessesesees
6
3-2.
Removal
of
Cassette
lid
ASSY
.0......ccceccccsssseesseevessseseecoeseseeesetees
6
3-3.
Removal
of
Holder
ooo...
ccc
ccscsscsscsscesescssessserasssesteeseseesccsseverseeees
6
3-4,
Removal
of
Main
board
oo...
ce
ecesscsssscseccseceeessssaensescssesseeteeee
7
3-5,"
“Removal
Of
Belt
ssisachatintiiedi
lina
hnvs
skiditinnaea
tn
7
3-6.
Installation
Of
Main
board
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ccc
ccescecescsccecsscecsesseseesecsesesensensess
7
SECTION
4.
ADJUSTMENTS
4-1.
Mechanical
Adjustments
...........ccccccssesessessercesesseressesesssseesssesesens
8
4-2.
Electrical
Adjustment
0.00...
ccececseseseesesseseeecssesseetassecersassessesaears
8
SECTION
5.
IC
PINFUNCTIONS
.............0.cccccceeesceeeseeee
9
SECTION6.
DIAGRAMS
6-1.
Semiconductor
Lead
Layouts
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10
G2).
BIOCK
Dome
ay
tacts
est,
2h
ces
stocceeseom
tuned
naaestgmeotesbuedesonss
11
6-3.
Printed
Wiring
Board
0.0...
.ccceeccessessesesesssneesesecaesecssaesersnenesees
13
6-4.
Schematic
Diagram
.........cccsessscsssscscesesscssesesssseesesseseesenecsecseseeseees
17
SECTION7.
EXPLODED
VIEWS
T-1.
Ornament
BIOCK
........cccceeecccsssecesssccessecccscseccesesessesesesessaeens
ee
21
7-2.
Main
Boards
BIOCK
0...
.ccccccceccsscsscesecsscsssesserssssssesscsacesesasenaseass
22
7-3.
Mechanism
Block
(MT-WMGX707-60)
....ccccsccecessccsseesscerereees
23
SECTION
8.
ELECTRICAL
PARTS
LIST
oo.
24
Notes
on
chip
component
replacement
*
Never
reuse
a
disconnected
chip
component.
¢
Notice
that
the
minus
side
of
a
tantalum
capacitor
may
be
damaged
by
heat.
Fiexible
Circuit
Board
Repairing
*
Keep
the
temperature
of
the
soldering
iron
around
270
°C
during
repairing.
¢
Do
not
touch
the
soldering
iron
on
the
same
conductor
of
the
circuit
board
(within
3
times).
¢
Becareful
not
to
apply
force
on
the
conductor
when
soldering
or
unsoldering.
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