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H11DSi / H11DSi-NT User's Manual
Note: The table above is continued on the next page.
Motherboard Features
CPU
•
Dual EPYC 7001/7002* Series Processors, in Socket SP3. (*AMD EPYC 7002 series drop-in support requires board
revision 2.x)
Memory
•
2 TB of ECC DDR4 2666 MHz speed/ 4TB of ECC DDR4 3200 MHz* speed, RDIMM/LRDIMM/3DS/NVDIMM memory in
Sixteen (16) slots (*Board reversion 2.x required)
DIMM Size
• Up to 128GB size at 1.2V
Chipset
•
System on Chip
Expansion Slots
•
2 x PCI-E 3.0 x16
• 3 x PCI-E 3.0 x8
• 2 x Internal NVMe Ports (PCI-E 3.0 x4)
• M.2 Interface: 1 SATA/PCI-E 3.0 x2
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
Network
•
Dual RJ45 LAN Ports (H11DSi-NT: Intel X550-BT2 / (H11DSi: I350-BT2)
• ATEN IPMI from ASPEED AST 2500 BMC for gigabit RJ45 port
Graphics
•
ASPEED AST2500 BMC chip with one (1) VGA port
I/O Devices
•
COM Port • One (1) COM connector on rear I/O panel
• SATA/NVMe Ports
• Eight (8) SATA 3.0 ports (iPASS)
• Two (2) SATA-DOM ports
• Two (2) internal NVMe ports (H11DSi-NT only)
Peripheral Devices
•
Two (2) USB 3.0 “Type A” ports on the rear I/O panel (USB 4/5)
• Two (2) USB 2.0 “Type A” ports on the rear I/O panel (USB 0/1)
• One (1) USB 2.0 header for front control panel (USB 2/3)
Motherboard Features
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