Supermicro X13DAI-T - Page 17

17
Chapter 1: Introduction
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications.
Note 2: For BMC conguration instructions, please refer to the Embedded BMC Con-
guration User's Guide available at https://www.supermicro.com/support/manuals/.