TDK-Lambda CC15-xxxx-Sxx-E Series - Soldering, Cleaning, and Installation Methods; Soldering Conditions for DIP and SMD Models; Cleaning Conditions After Soldering

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5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Condi5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Conditions / Installation Method
tions / Installation Methodtions / Installation Method
tions / Installation Method
5-1 Soldering Conditions
【DIP Model】
Perform soldering of the converter to the board according to the conditions shown in Table 5-1.
 Soldering is to be performed only one time per pin.
Table 5-1 Solder Conditions for DIP Models
Method Condition
Solder Dip 260℃ 10 sec Max.
Solder Iron 380℃ 3 sec Max.
【SMD Model】
Lead free solder / high temperature reflow process conditions are shown in Figure 5-1.
 The number of times permitted for reflow is 1 time.
TP
225
Ty2
Ty1
部品表面温度（℃）
ハンダ付け時間（s)
A 'A B B ' C
A
A '
B
B '
C
1.0～3.0℃/sec
Ty1：150±10℃
Ty2：170±10℃
Ty1～Ty2：20～100sec
1.0～4.0℃/sec
TP：MAX 245℃
225℃以上：20～40sec
-1.0～-5.0℃/sec
Fig. 5-1 Reflow Process Conditions for SMD Models
5-2 Washing Conditions
We do not recommend board cleaning after soldering, we recommend not performing cleaning, but when cleaning becomes
necessary, perform it according to the conditions shown in Table 5-2
Table 5-2 Cleaning Fluid and Test Conditions
Cleaning Fluid Cleaning Method Time
Ultrasonic Wave 60℃ 60 sec.
Cold Bath Cleaning R.T 60 sec.
Isopropyl Alcohol
Vapor Cleaning 83℃ 60 sec.