TELINK SEMICONDUCTOR TLSR8232 - Page 7

Telink TLSR8232 BLE SDK Developer Handbook
AN-19112700-E1 6 Ver.1.0.0
3.4.2.2 perm ................................................................................................. 93
3.4.2.3 uuid, uuidLen ................................................................................... 94
3.4.2.4 pAttrValue, attrLen ........................................................................... 94
3.4.2.5 Callback Function w ......................................................................... 95
3.4.2.6 Callback Function r .......................................................................... 97
3.4.2.7 Attribute Table Layout ...................................................................... 98
3.4.2.8 ATT Table Initialization .................................................................... 99
3.4.3 Attribute PDU & GATT API ........................................................................ 99
3.4.3.1 Read by Group Type Request, Read by Group Type Response . 100
3.4.3.2 Find by Type Value Request, Find by Type Value Response ...... 101
3.4.3.3 Read by Type Request, Read by Type Response ........................ 101
3.4.3.4 Find Information Request, Find Information Response ................ 102
3.4.3.5 Read Request, Read Response .................................................... 103
3.4.3.6 Read Blob Request, Read Blob Response ................................... 103
3.4.3.7 Exchange MTU Request, Exchange MTU Response ................... 104
3.4.3.8 Write Request, Write Response .................................................... 105
3.4.3.9 Write Command ............................................................................. 106
3.4.3.10 Handle Value Notification ............................................................ 106
3.4.3.11 Handle Value Indication ............................................................... 107
3.4.3.12 Handle Value Confirmation .......................................................... 108
3.5 SMP .................................................................................................................... 109
3.5.1 SMP Parameter Configuration ................................................................. 109
3.5.1.1 Device Bonding .............................................................................. 109
3.5.1.2 Device OOB data verification ........................................................ 109
3.5.1.3 Secure Connection Pairing (SC) ................................................... 109
3.5.2 Enable SMP ............................................................................................. 110
3.5.3 SMP Event ............................................................................................... 111
3.5.3.1 BLT_EV_FLAG_PAIRING_BEGIN ................................................ 111
3.5.3.2 BLT_EV_FLAG_PAIRING_END ................................................... 112
3.5.4 SMP Bonding Information ........................................................................ 112
4. Power Management (PM) ............................................................................................ 115
4.1 PM Driver ............................................................................................................ 115
4.1.1 Low Power Modes .................................................................................... 115
4.1.2 Hardware Wakeup Sources ..................................................................... 115