Telit Wireless Solutions ME910G1-WW - Page 7

ME910G1 HW Design Guide
1VV0301593 Rev.3 Page 7 of 97 2020-03-24
6. RF SECTION .............................................................................. 61
Bands Variants ........................................................................... 61
TX Output power ......................................................................... 61
RX Sensitivity ............................................................................. 61
Antenna requirements................................................................. 61
6.4.1. PCB Design guidelines ............................................................... 62
6.4.2. PCB Guidelines in case of FCC Certification .............................. 63
6.4.2.1. Transmission line design ............................................................ 64
6.4.2.2. Transmission Line Measurements .............................................. 65
6.4.2.3. Antenna Installation Guidelines ................................................... 67
7. AUDIO SECTION ....................................................................... 68
Electrical Characteristics ............................................................. 68
Codec examples ......................................................................... 68
8. GNSS SECTION ......................................................................... 69
GNSS Signals Pin-out................................................................. 69
RF Front End Design .................................................................. 69
8.2.1. Guidelines of PCB line for GNSS Antenna .................................. 69
GNSS Antenna Requirements .................................................... 70
8.3.1. GNSS Antenna specification ....................................................... 70
8.3.2. GNSS Antenna – Installation Guidelines ..................................... 70
8.3.3. Powering the External LNA (active antenna) ............................... 70
GNSS Characteristics ................................................................. 71
9. MECHANICAL DESIGN ............................................................. 72
Drawing ...................................................................................... 72
10. APPLICATION PCB DESIGN .................................................... 73
Recommended footprint for the application ................................. 73
PCB pad design .......................................................................... 75
Recommendations for PCB pad dimensions ............................... 76
Thermal performance.................................................................. 77
Stencil ......................................................................................... 77
Solder paste ............................................................................... 78
Solder Reflow ............................................................................. 78
Inspection ................................................................................... 80
11. PACKAGING .............................................................................. 81
Tray ............................................................................................ 81
Reel ............................................................................................ 83