Telit Wireless Solutions ME910G1-WW - Solder Paste; Solder Reflow

ME910G1 HW Design Guide
1VV0301593 Rev.3 Page 78 of 97 2020-03-24
The stencil should be made from stainless steel and the apertures layout can be the same
of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil).
A stencil thickness of 152 µm (6 mil) can be used as well.
Solder paste
Various types and grades of solder paste can be used for surface mounting Telit modules.
For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used.
Any Type 3 solder paste that is either water-soluble or no clean is acceptable.
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile:
Profile Feature
Pb-Free Assembly Free
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above: