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Telit Wireless Solutions ME910G1 Series - User Manual

Telit Wireless Solutions ME910G1 Series
97 pages
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[04.2016]
Mod. 0805 2016-08 Rev.5
ME910G1
HW Design Guide
1VV0301593 Rev. 3 2020-03-24

Table of Contents

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Telit Wireless Solutions ME910G1 Series Specifications

General IconGeneral
BrandTelit Wireless Solutions
ModelME910G1 Series
CategoryGSM/GPRS Modules
LanguageEnglish

Summary

NOTICE

COPYRIGHTS

COMPUTER SOFTWARE COPYRIGHTS

USAGE AND DISCLOSURE RESTRICTIONS

License Agreements

Details the licensing terms under which the software is provided.

Copyrighted Materials

Information on the protection and reproduction rights of copyrighted materials.

High Risk Materials

Disclaimer for the product's non-suitability in high-risk applications.

Trademarks

Information on Telit's trademarks and other product/service names.

Third Party Rights

Explains the rights and terms related to included third-party software.

APPLICABILITY TABLE

INTRODUCTION

Scope

Defines the document's purpose and the hardware solutions described.

Audience

Identifies the intended readers for this technical guide.

Contact Information, Support

Provides contact details for technical support and inquiries.

Text Conventions

Explains symbols and formatting used for clarity in the document.

Related Documents

Lists other essential documentation for further reference.

GENERAL PRODUCT DESCRIPTION

Product Variants and Frequency Bands

Lists product variants and the supported LTE/2G frequency bands.

Main features

Highlights key functionalities like CATM/NBIoT, SMS, and GPIOs.

TX Output Power

Specifies the transmit output power levels for different bands and modes.

RX Sensitivity

Details the receiver sensitivity performance across various bands.

Temperature Range

Specifies the operating and storage temperature limits for the module.

PINS ALLOCATION

Pin-out

Provides a comprehensive list of pin assignments and their functions.

LGA Pads Layout

Visual representation of the module's LGA pad configuration from a top view.

POWER SUPPLY

Power Supply Requirements

Specifies the nominal voltage, operating ranges, and VBATTmin for the module.

Power Consumption

Details the module's power consumption in various operational modes.

General Design Rules

Encompasses electrical, thermal, and PCB layout guidelines for power supply.

DIGITAL SECTION

Logic Levels

Defines the input/output voltage levels for CMOS 1.8V interfaces.

Power On

Details the procedure and circuit for powering on the module.

Power Off

Explains the methods for safely powering off the module.

Unconditional Shutdown

Details the hardware signal for an unconditional reset and shutdown.

Communication ports

Covers USB 2.0 HS, SPI, and Serial Ports interfaces.

General purpose IO

Explains the configuration and usage of General Purpose Input/Output pins.

RF SECTION

Bands Variants

Lists the supported frequency bands for different ME910G1 variants.

TX Output power

Specifies the transmit output power levels for various bands.

RX Sensitivity

Details the receiver sensitivity performance for different bands.

Antenna requirements

Outlines crucial requirements for antenna connection and PCB layout.

AUDIO SECTION

Electrical Characteristics

Specifies the electrical characteristics of the DVI pins.

Codec examples

Provides examples for integrating audio codecs with the module.

GNSS SECTION

GNSS Signals Pin-out

Details the pin assignments for GNSS antenna and LNA enable signals.

RF Front End Design

Describes the pre-select SAW filter and LNA requirements for GNSS.

GNSS Antenna Requirements

Specifies antenna frequency range, gain, impedance, and VSWR.

GNSS Characteristics

Information on the GNSS receiver's performance characteristics.

MECHANICAL DESIGN

Drawing

Technical drawing illustrating the module's physical dimensions and pad layout.

APPLICATION PCB DESIGN

Recommended footprint for the application

Specifies the recommended SMT footprint and pad dimensions for the module.

PCB pad design

Discusses Solder Mask Defined (SMD) vs. Non-Solder Mask Defined (NSMD) pad types.

Thermal performance

Details thermal considerations and the use of thermal vias for heat dissipation.

Solder Reflow

Details the recommended solder reflow profile and process parameters.

PACKAGING

Reel

Information on reel packaging for automated pick-and-place processes.

Moisture sensitivity

Guidelines for handling moisture-sensitive devices (MSD) according to J-STD-020.

CONFORMITY ASSESSMENT ISSUES

Approvals

Lists the type approvals obtained for ME910G1-W1 and ME910G1-WW.

FCC certificates

Provides the internet address for obtaining FCC certificates.

ICISED certificates

Provides the internet address for obtaining IC/ISED certificates.

FCCISED Regulatory notices

Contains important regulatory compliance statements and warnings.

SAFETY RECOMMENDATIONS

READ CAREFULLY

Emphasizes the critical importance of reading and following all safety instructions.

ACRONYMS

DOCUMENT HISTORY

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