Name: Telit Wireless Solutions ME910G1 Series
Brand: Telit Wireless Solutions
Rating: 4 (1 reviews)

To Next Page

To Previous Page

ME910G1 HW Design Guide

1VV0301593 Rev.3 Page 80 of 97 2020-03-24

Inspection

An inspection of the solder joint between the solder pads of the Telit module and the

application PCB should be performed. The best visual inspection tool for inspection of the

Telit module solder joints on the PCB is a transmission X-ray, which can identify defects

such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder

joints are not detrimental to the reliability of the solder joint).

Questions and Answers:

Need help?

Do you have a question about the Telit Wireless Solutions ME910G1 Series and is the answer not in the manual?

Telit Wireless Solutions ME910G1 Series Specifications

General