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Toshiba Tecra A11 User Manual

Toshiba Tecra A11
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User’s Manual 4-5
Operating Basics
Do not paste stickers or write on the sensor.
Do not touch the sensor with a finger or any other object which may
have a build-up of static electricity on it.
Observe the following before you place your finger on the sensor whether
for fingerprint enrollment/registration or recognition.
Wash and dry your hands thoroughly.
Remove static electricity from your fingers by touching any metal
surface. Static electricity is a common cause of sensor failures,
especially when the weather is dry.
Clean the sensor with a lint-free cloth - do not use detergent or any
other chemicals to clean the sensor.
Avoid the following finger conditions for enrollment or recognition as
they may result in fingerprint enrollment errors or a drop in the
fingerprint recognition success rate
Soaked or swollen finger, for example as may occur after taking a
bath.
Injured finger
Wet finger
Soiled or oily finger
Extremely dry skin condition on finger
Observe the following to improve the fingerprint recognition success rate.
Enroll two or more fingers.
Enroll additional fingers if a recognition failure often occurs when using
already enrolled fingers.
Check the condition of your finger - any conditions which have changed
since enrollment, such as injury, rough skin, and extremely dry, wet,
soiled, dirty, oily, soaked or swollen fingers, may lower the recognition
success rate. Also if the fingerprint is worn down or the finger becomes
thinner or fatter, the recognition success rate may be lowered.
As the fingerprint for each finger is different and unique you should
ensure that only the registered or enrolled fingerprint or fingerprints are
used for identification.
Check the position and speed at which you swipe your finger across the
sensor - please refer to the preceding drawing.
The fingerprint sensor compares and analyzes the unique
characteristics in a fingerprint. However, there may be instances where
certain users are unable to register their fingerprints due to insufficient
unique characteristics in their fingerprints.
The recognition success rate may differ from user to user.
Points to note about Fingerprint Utility
If Windows 7 file encryption function EFS (Encryption File System) is
used to encrypt a file, the file cannot be further encrypted using the
encryption function of this software.

Table of Contents

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Toshiba Tecra A11 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache4 MB
Processor cores2
Processor modeli7-620M
System bus rate2.5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-600 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.66 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus1066 MHz
PCI Express slots version2.0
Processor boost frequency3.33 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)20
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
HDD speed7200 RPM
HDD interfaceSATA
Optical drive typeDVD Super Multi DL
Total storage capacity320 GB
Number of HDDs installed1
LED backlightYes
Display diagonal15.6 \
Display resolution1600 x 900 pixels
Native aspect ratio16:9
Internal memory4 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)2 x 2 GB
TypePC
Wireless technology802.11a/g/n
CD-R write speed24 x
CD-RW write speed4 x
Bluetooth version2.1+EDR
Networking features1Gbit
Trial softwareOffice
Operating system installedWindows 7 Professional
Battery life (max)4 h
Charging port typeDC-in jack
Serial ports quantity0
USB 2.0 ports quantity3
Cable lock slot typeKensington
Pointing deviceTouchpad
Discrete graphics card modelGMA QM57
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
Processor codeSLBPE
Processor ARK ID43560
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1/4.2
Intel® Turbo Boost Technology1.0
Physical Address Extension (PAE)36 bit
Weight and Dimensions IconWeight and Dimensions
Depth250.5 mm
Width374 mm
Weight2800 g
Height (rear)37.6 mm
Height (front)33.4 mm

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